4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind
Production description :
this board is 4 layer with 1oz copper thickness. it is used for
antenna equipment. PCB prototype,small volum, middle and large
volume are accepted. no MOQ request for new boards. for repeat
order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
|Production Types:||high TG Rigid PCB|
|Base Material :||FR4 tg170|
|Copper Thickness :||1oz|
|Board Thickness :||0.80 mm|
|Min. Finish Hole Size :||8 mil (0.10mm)|
|Min. Line Width :||4 mil|
|Min. Line Spacing :||4 mil|
|Surface Finishing :||ENIG|
|Drilling hole tolerance:||+/-3 mil ( 0.075mm )|
|Min Outline tolerance :||+/-4 mil ( 0.10mm )|
|Working panel size :||max:1200mmX600mm (47'' X24'')|
|Outline profile:||Punching, Routing , CNC routing + V-cut|
|Solder mask :||LPI Solder mask, Peelable mask|
|Solder Mask Color :||Blue, black,yellow, matte green|
|Certificate :||UL, CQC, TS16949, ISO14000, ROHS|
|Silkscreen color :||White|
|Twist and Bow :||no more than 0.75 %|
Our products are widely used in meter, medical, solar energy,
mobile, communication, industrial control, power
electronics,security, consum electronics, computer, automotive,
aerospace, military and so on.
Rigid PCB Technical Capability:
|Layers||1-28 layers||Min. line width/space||4mil|
Max.board size (single&doule
|600*1200mm||Min.annular ring width: vias||3mil|
HAL lead free,gold flash
Immersion silver,Immersion gold ,Immersion Sn,
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,
ISOLA,polyclad 370 HR); heavy copper,
Metal base clade laminate
Plating thickness (Technique:
|Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type:
Imm Au, Min./Max thickness:2/4U''|
|Impedance control||± 10%|
line to board edge
Base copper thickness(Inner
and outer layer)
|Min. thickness: 0.5 OZ Max.thickness: 6OZ||Min.hole size(board thickness ≥2mm)||Aspect ratio≤16|
|Finished copper thickness||Outer layers:|Min.thickness 1 OZ,
Max.thickness 10 OZ
Max.thickness : 6 OZ
|Max.board thickness(single&doule sided)||3.20mm|
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying
Probe,e-Testing, X-ray Inspection, AOI (Automated Optical
1.4.Dedicated quality assurance team with failure case analysis
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.