1.80mm Thickness Multilayer PCB Board 6 Layer Circuit Board
Production description :
this board is 6 layer with 1oz copper thickness for electronic
device. we can accept any quantity board such as PCB
prototype,samll volum, middle and large volume . no MOQ request for
new order. all of these boards are met UL,TS16949, ISO9001 Etc.
Key Specifications/Special Features:
Finish thickness :
Minimum width/spacing :
0.127 / 0.127mm
Minimum via dia :
Surface finish :
Solder mask :
ISO UL ROHS SGS
Punching, Routing , CNC routing + V-cut
Solder mask :
LPI Solder mask, Peelable mask
UL, CQC, TS16949, ISO14000, ROHS
Min finished hole size:
PCB Flow Chart.pdf
PCBs which are widly used in following Electronics field:
Industril Control System
LED drive, LED Lighting
Full range of testing services:
▪ AOI, function testing, In circuit testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken
▪ Using our X-ray machine, we test PCBs to component level and all
wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team
using AOI and high magnification viewers
1. What are the main factors which will affect the price of PCB?
Board thickness, Copper thickness;
Different quality criteria;
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying
Probe,e-Testing, X-ray Inspection, AOI (Automated Optical
1.4.Dedicated quality assurance team with failure case analysis
3. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG,
OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin,
silver plating, immersion tin plating, carbon ink and etc. .. OSP,
ENIG, OSP + ENIG commonly used on the HDI, we usually recommend
that you use a client or OSP OSP + ENIG if BGA PAD size less than