1.60mm High Frequency Rigid Circuit Boards With GREEN Solder Mask
Production description :
this board is 6layer rigid pcb for wireless antenna . all of our
board are met UL, ISO9001, TS1694 certification etc.no MOQ request
for new boards, for repeat order, just meet 3sq.m.
Key Specifications of single PCB board :
|Production Types:||Rigid PCB|
|Layer :||6 Layer|
|Base Material :||FR4 fiber glass|
|Copper Thickness :||1 oz|
|Board Thickness :||1.60mm|
|Min. Finish Hole Size :||8 mil (0.10mm)|
|Min. Line Width :||4 mil|
|Min. Line Spacing :||4 mil|
|Surface Finishing :||OSP|
|Drilling hole tolerance:||+/-3 mil ( 0.075mm )|
|Min Outline tolerance :||+/-4 mil ( 0.10mm )|
|Working panel size :||max:1200mmX600mm (47'' X24'')|
|Outline profile:||Punching, Routing , CNC routing + V-cut|
|Solder mask :||LPI Solder mask, Peelable mask|
|Solder Mask Color :||Blue, black,yellow, matte green|
|Certificate :||UL, CQC, TS16949, ISO14000, ROHS|
|Silkscreen color :||White|
|Twist and Bow :|
no more than 0.75 %
|Category||Performance indicator||Quality Goal|
|Customer service rate||99.9%|
|Semi Finished product||Process inspection pass rate||100%|
|Finished product||FQA Rebate rate||0.1%|
|Scrapped||1L scrap rate||0.5%|
|2L scrap rate||1%|
|Multi Layer scrap rate||2%|
|Customers||Customer complaint rate||0.8%|
|Customer return rate||0.5%|
Product Application Field :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying
Probe,e-Testing, X-ray Inspection, AOI (Automated Optical
1.4.Dedicated quality assurance team with failure case analysis
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.