FR4 Tg180 1.35mm Thickness Lead Free Board Impedance Conrol Board
For LCD Display
Production description :
this board is 8 layer with 1.35 mm thickness for LCD display. we
can do PCB prototype,small volum, middle and large volume . no MOQ
request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
|Production Types:||Rigid PCB|
|Base Material :||FR4 tg180|
|Copper Thickness :||1.0 oz|
|Board Thickness :||0.30mm|
|Min. Finish Hole Size :||8 mil (0.10mm)|
|Min. Line Width :||4 mil|
|Min. Line Spacing :||4 mil|
|Surface Finishing :||Immerison gold|
|Drilling hole tolerance:||+/-3 mil ( 0.075mm )|
|Min Outline tolerance :||+/-4 mil ( 0.10mm )|
|Working panel size :||max:1200mmX600mm (47'' X24'')|
|Outline profile:||Punching, Routing , CNC routing + V-cut|
|Solder mask :||LPI Solder mask, Peelable mask|
|Solder Mask Color :||Blue|
|Certificate :||UL, CQC, TS16949, ISO14000, ROHS|
|Silkscreen color :||White|
|Twist and Bow :||no more than 0.75 %|
PCB Flow Chart.pdf
Rigid PCB Technical Capability:
|Layers||1-28 layers||Min. line width/space||4mil|
Max.board size (single&doule
|600*1200mm||Min.annular ring width: vias||3mil|
HAL lead free,gold flash
Immersion silver,Immersion gold ,Immersion Sn,
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,
ISOLA,polyclad 370 HR); heavy copper,
Metal base clade laminate
Plating thickness (Technique:
|Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type:
Imm Au, Min./Max thickness:2/4U''|
|Impedance control||± 10%|
line to board edge
Base copper thickness(Inner
and outer layer)
|Min. thickness: 0.5 OZ Max.thickness: 6OZ||Min.hole size(board thickness ≥2mm)||Aspect ratio≤16|
|Finished copper thickness||Outer layers:|Min.thickness 1 OZ,
Max.thickness 10 OZ
Max.thickness : 6 OZ
|Max.board thickness(single&doule sided)||3.20mm|
Our products are widely used in meter, medical, solar energy,
mobile, communication, industrial control, power
electronics,security, consum electronics, computer, automotive,
aerospace, military and so on.
1. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc.
3. How many types of surface finish ACCPCB can do?
ACCPCB has the full series of surface finish, such as: ENIG, OSP,
LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver
plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG,
OSP + ENIG commonly used on the HDI, we usually recommend that you
use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
4. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG,
OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin,
silver plating, immersion tin plating, carbon ink and etc. .. OSP,
ENIG, OSP + ENIG commonly used on the HDI, we usually recommend
that you use a client or OSP OSP + ENIG if BGA PAD size less than