Brand Name : ACCPCB
Model Number : P1116168
Certification : ISO, UL, SGS,TS16949
Place of Origin : China
MOQ : 10PCS
Price : Negotiable
Payment Terms : L/C / T/T / Western Union / Paypal
Supply Ability : 30,000SQ.M/Per Month
Delivery Time : 10-12days
Packaging Details : Vacuum packing with desiccant
Material : FR4 tg180
Thickness : 1.35mm
Surface Finish : Immersion gold
Layer : 8L
Copper thicknes : 1.0 0Z
PCB Standard : IPC-A-610 D
Type : customized PCB
Min Holes Size : 4mil
Min. Line Width : 4mil
Min Copper Thicness : 20um
Solder mask color : bule
Application : LCD display
FR4 Tg180 1.35mm Thickness Lead Free Board Impedance Conrol Board For LCD Display
Production description :
this board is 8 layer with 1.35 mm thickness for LCD display. we can do PCB prototype,small volum, middle and large volume . no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
Production Types: | Rigid PCB |
Layer : | 8 Layers |
Base Material : | FR4 tg180 |
Copper Thickness : | 1.0 oz |
Board Thickness : | 0.30mm |
Min. Finish Hole Size : | 8 mil (0.10mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | Immerison gold |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Rigid PCB Technical Capability:
Items | Technical Capability | ||
Layers | 1-28 layers | Min. line width/space | 4mil |
Max.board size (single&doule sided) | 600*1200mm | Min.annular ring width: vias | 3mil |
Surface finish | HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm |
Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
Base copper thickness(Inner and outer layer) | Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
Finished copper thickness | Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ | Max.board thickness(single&doule sided) | 3.20mm |
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.
FAQ :
1. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. How many types of surface finish ACCPCB can do?
ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
4. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
FR4 Tg180 1.35mm Thickness Lead Free Board Impedance Conrol Board For LCD Display Images |